Intel® Core™ i3 Overclocking Buildlog
By Jake Crimmins posted Aug 30th 2010
At CES 2010 Intel launched their new Clarkdale Core i3 and Core™ i5 32nm CPU lineup with an IGP (Integrated Graphics Processor) on the CPU as well as the H55/H57 chipset to support the new CPUs with IGP. The new lineup consists of dual core processors with Hyper Threading for a total of four threads. With the exception for the Core i5 661, the new 32nm Core i3 and Core i5 processors are rated at a mere 73 Watts max TDP.
Normally a die shrink such as the one Intel did to achieve 32nm processors allows processors to run cooler, overclock further, and use less power. Intel also cut power usage by efficiently cutting power to the core while in an idle state and retaining the data in SRAM.
The Core i3 530 has a price tag of just over $100 and a frequency of 2930 MHz. Let’s see just how far this budget-minded CPU can be overclocked.










Judging by the title of this blog you might think that I’m about to discuss the Corsair Cooling™ Hydro Series H50 High Performance CPU cooler, since "big cooling in a small package" is a very accurate description of this mighty little cooler. And you’d almost be correct, because while this post does revolve around the Hydro Series H50, it more accurately concerns a very cool implementation of this product that will appeal to LAN gamers and lovers of miniature PCs in general. I’m talking about a quad-core, DirectX 10.1-powered Mini-ITX LAN gaming box, no larger than an average shoebox, liquid-cooled using the Corsair Cooling Hydro Series H50.
Solid-state drives have been around in one form or another for quite some time, but it’s only in the last 18-24 months that they have really started to come into their own for mainstream consumers and enthusiasts. In fact, 2009 could be viewed as the year that SSD really ‘arrived’, and 2010 is going to be even better.